Analytical Electron Microscopy of Lead-free Nanopowder Solders
| Authors | |
|---|---|
| Year of publication | 2010 |
| Type | Article in Proceedings |
| Conference | NANOCON 2010, 2ND INTERNATIONAL CONFERENCE |
| MU Faculty or unit | |
| Citation | |
| Web | http://www.nanocon.eu/files/proceedings/nanocon_10/lists/papers/456.pdf |
| Field | Thermodynamics |
| Keywords | solder; nanopowder; nanoindentation; temperature |
| Description | In this work we study the quality of bulk materials produced of Ag nanopowders annealed at various temperatures. Ag nanoparticles were studied in a transmission electron microscope. Sandwich structures were prepared of Cu disks and a layer of Ag nanopowder. The sandwiches were annealed in the range from 200 to 350 oC, metallographic cross sections were prepared from annealed samples and the microstructure and quality of joints was studied by analytical electron microscopy and depth sensing indentation technique. |
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