A comparison of chemical and atmospheric plasma assisted copper plating on carbon fiber reinforced epoxy polymer surfaces
| Authors | |
|---|---|
| Year of publication | 2014 |
| Type | Article in Periodical |
| Magazine / Source | Surface and Coatings Technology |
| MU Faculty or unit | |
| Citation | |
| Web | http://www.sciencedirect.com/science/article/pii/S0257897214005982 |
| Doi | http://dx.doi.org/10.1016/j.surfcoat.2014.07.026 |
| Field | Plasma physics |
| Keywords | Non-thermal plasma pre-treatment; Chemical pre-treatment; Carbon fiber reinforced polymer; Metallization; Copper plating |
| Description | In the present study a comparison of two different surface pre-treatments and their influence on a subsequent surface metallization were studied. Standard electroless copper deposition involving initial etching in mild acid is thoroughly compared with the process where plasma pre-treatment replaced the mild acid etch. Specific surface co-planar type of dielectric barrier discharge was employed. Results demonstrated both approaches being able to achieve excellent adhesion of final coating. In contrast to standard chemical pre-treatment, plasma pre-treatment is associated with changes of initial composite surface chemistry only. XPS analysis revealed, that Pd atom on plasma treated surface takes the form of its oxide compounds PdO and PdO2 preferably, while its form on the surface of standard chemical pre-treatment is mostly metallic-Pd. |
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