Interaction of elements in the copper/indium-tin diffusion joints at 400 and 600 oC

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Authors	DRÁPALA Jaromír KOZELKOVÁ Renata KUBÍČEK Petr VŘEŠŤÁL Jan KROUPA Aleš
Year of publication	2007
Type	Article in Periodical
Magazine / Source	University Review
MU Faculty or unit	Faculty of Science
Citation
Field	Thermodynamics
Keywords	reaction diffusivity; copper/indium/tin ternary system
Description	New experimetal data describing phase equilibria in the Cu-In-Sn system after long-term diffusion annealing at the 400 and 600 oC are presented.
Related projects:	Theoretical Modelling of Phase Diagrams of Low Melting Point Metals