Stabilita nanočástic cínu, mědi a stříbra

Warning

This publication doesn't include Institute of Computer Science. It includes Faculty of Science. Official publication website can be found on muni.cz.

Title in English	Stability of Tin, Copper and Silver Nanoparticles
Authors	BROŽ Pavel SOPOUŠEK Jiří
Year of publication	2009
Type	Article in Proceedings
Conference	31. Mezinárodní slovenský a český kalorimetrický seminář
MU Faculty or unit	Faculty of Science
Citation
Field	Physical chemistry and theoretical chemistry
Keywords	Calorimetry; thermal analysis; X-ray diffraction analysis; transmission electron microscopy; CALPHAD
Description	The contribution deals with experimental and theoretical study of tin, copper and silver nanoparticles as potential candidates for lead-free soldering at higher temperatures. Techniques of DSC, RTG diffraction analysis and transmission electron microscopy were used for investigation of melting point depression and surface effects and the results were supported by phase diagram calculations based on CAPLHAD method.
Related projects:	Physical and chemical properties of advanced materials and structures Thermodynamics and microstructure of environmentally friendly nanoparticle solders Thermodynamic and Phase Diagram Studies of Systems for High Temperature Lead-Free Solders