Technologie pro depozici materiálu magnetronovým naprašováním
| Title in English | Technology for thin film deposition by magnetron sputtering |
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| Authors | |
| Year of publication | 2018 |
| MU Faculty or unit | |
| Description | The proposed technology demonstrates that the use of DC magnetron sputtering results in a deposition of a layer four times faster compared to magnetron sputtering excited by high power pulses, and therefore the process is more efficient and less energy consuming. However, using a high power impulse magnetnetron sputtering leads to deposition of a layer not only by the sputterred atoms but also by the ions of the sputtered material, which results in the preparation of improved thin films (e.g. greater adhesion to the substrate, lower roughness or higher density), and thus it leads to depostion of thin films with higher added values. In this case, up to 48% of ions of sputered materials will be deposited at the substrate position. |
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