Influence of substrate material on plasma indeposition/sputtering reactor: experiment and computer simulation
| Authors | |
|---|---|
| Year of publication | 2008 |
| Type | Article in Periodical |
| Magazine / Source | Journal of Physics D: Applied Physics |
| MU Faculty or unit | |
| Citation | |
| Field | Plasma physics |
| Keywords | r.f. plasma; computer simulation; secondary electron emision; plasma deposition; plasma sputtering |
| Description | The aim of the present work was to investigate the influence of the substrate material on the plasma enhanced chemical vapor deposition and the plasma sputtering of thin films in low pressure parallel-plate r.f. discharges. It was observed that the deposition or sputtering rates differed above different materials, e.g., above a substrate and substrate electrode. Moreover, the substrates placed on the bottom r.f. electrode seemed to be mirrored in the thickness of a thin film deposited or sputtered on the upper grounded electrode. The influence of the substrate material on the plasma parameters was studied via Particle In Cell/Monte Carlo computer simulation. According to our finding the mirroring of the substrate was caused by different secondary electron emission yields of the substrate material and material of the substrate electrode. |
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