Behaviour of Hybrid PVD-PECVD Process in Comparison with Conventional Reactive Magnetron Sputtering
| Authors | |
|---|---|
| Year of publication | 2010 |
| Type | Article in Proceedings |
| Conference | 7th ICRP & 63rd GEC - CONFERENCE PROCEEDINGS |
| MU Faculty or unit | |
| Citation | |
| Field | Plasma physics |
| Keywords | hybrid PVD-PECVD process; magnetron sputtering; hysteresis; OES |
| Description | Hybrid PVD-PECVD sputtering process was studied in comparison with conventional reactive magnetron sputtering. Titanium target was sputtered in argon plus oxygen atmosphere for conventional reactive sputtering and in argon plus acetylene for hybrid process. The hybrid PVD-PECVD combines aspects of both processes: conventional sputtering of metal target but source of carbon was hydrocarbon vapour. We report differences in behaviour of these two processes, discuss necessary time for hybrid process to achieve steady state conditions and suggest modification of Berg's model for reactive magnetron sputtering to predict behaviour of hybrid process. |
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